概述

The Royce Instruments Autoplacer MP300 is an automated die sorter used in the semiconductor industry for medium volume/high mix applications. It is designed for automatic die sorting from wafer maps, including multi-project wafers. The MP300 is fully automated pick-and-place and has a user-friendly DieSort Manager software and expanded wafer map library. This tool can handle 6 inch wafers and has a brushless spindle motor capable of attaining 50,000 RPM/second. It is capable of handling die sizes ranging from approximately 0.005" to 0.121" and has a motorized die eject stage.