![BESI / ESEC 2100 FC hS](https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/cbc44f5941c240c3bb2d7d99df14e693/70037696c2254b83ab3b7c77b38d829d_a3a1438015034deaaeb3eecfb93a84ef1201a_lw.jpeg)
说明
无说明配置
- 100V-240V - 50Hz/60Hz - 1050/220VOEM 型号描述
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文件
无文件
BESI / ESEC
2100 FC hS
已验证
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
82121
晶圆尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部BESI / ESEC
2100 FC hS
类别
Die Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
82121
晶圆尺寸:
未知
年份:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
- 100V-240V - 50Hz/60Hz - 1050/220VOEM 型号描述
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文件
无文件