概述

DMX401 Die Bonder, a cutting-edge semiconductor assembly tool engineered to elevate production efficiency and precision. With its multi-chip mounting function, the DMX401 enables seamless single-pass production of stacked dies and multi-chip packages, revolutionizing the packaging process. The bonding nozzle auto changer ensures swift transitions between bonding tasks, reducing downtime and maximizing output. Experience uninterrupted workflow with the automatic work pallet exchange during production, for a continuous and smooth work pallet supply