说明
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.配置
无配置OEM 型号描述
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文件
无文件
ASM
AD898
已验证
类别
Die Sorters & Attachers
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
13138
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD898
已验证
类别
Die Sorters & Attachers
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
13138
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.配置
无配置OEM 型号描述
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.文件
无文件