The DB-900 is equipped with a newly-designed high-speed bond head for the middle-end chip assembly market. This die bonder is designed to accommodate a 0.15mm pitch for miniature microchips and achieves a throughput of 18,000UPH(*) via a high-speed linear motor and paste application system.

Hitachi High-Tech offers a range of advanced industrial equipment solutions for assembly and processing machines used in the production of lithium batteries, auto parts and advanced film. Also offered R&D equipment necessary for the development of FC, organic materials, and catalyst materials.

DB-900

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