Sorter
Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput (25,000 UPH)
Process : From dead bug (Ball up) to live bug (Ball down offloading)
Vision inspection : orientation, ball, mark, PKG align and side vision (optional)
Tray placement rate : 100% (RCPM)
Easy conversion and maintenance
Enhanced cleaning system (PVA and Bubble Jet)

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

SW6000 PLUS

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