说明
无说明配置
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM 型号描述
未提供文件
无文件
ULVAC
NE-950EX
已验证
类别
Dry Etch
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
24162
晶圆尺寸：
6"/150mm
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
NE-950EX
已验证
类别
Dry Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
24162
晶圆尺寸：
6"/150mm
年份：
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM 型号描述
未提供文件
无文件