概述

The eMax chamber operates in a new process regime that distinguishes it from other medium density plasma systems and enables the precise, high-throughput etching of very small, deep features. The system's unique, tunable, magnetic confinement technology and cost-effective approach to controlling temperature allow the eMax chamber to achieve low particle levels and extended MWBC (mean wafers between clean) intervals, resulting in a significant advantage in system cost-of-ownership.The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.