概述

The 300-mm Suprema strip system is based on a flexible, modular design that makes it ideal for both development and production environments. The system features vacuum and atmospheric robotics said to deliver increased throughput of greater than 300 wafers per hour. This represents more than a 40 percent improvement compared to competitive systems for bulk strip applications. Suprema's proprietary inductively coupled plasma source provides increased strip rates of over 9 microns/minute. Its vacuum robot utilizes a transfer mechanism, capable of transferring four wafers simultaneously, to minimize overhead time. Suprema can be configured with two dual-wafer modules.