说明
无说明配置
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM 型号描述
Deep Reactive Ion Etching (DRIE)文件
无文件
STS
MESC MULTIPLEX ICP
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
97582
晶圆尺寸：
4"/100mm, 6"/150mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
STS
MESC MULTIPLEX ICP
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
97582
晶圆尺寸：
4"/100mm, 6"/150mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM 型号描述
Deep Reactive Ion Etching (DRIE)文件
无文件