TELIUS SP 305 SCCM
概述
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Dry / Plasma Etch年份: 2008状况: 二手上次验证60 多天前TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Dry / Plasma Etch年份: 状况: 二手上次验证6 天前TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Dry / Plasma Etch年份: 2007状况: 二手上次验证6 天前TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Dry / Plasma Etch年份: 状况: 二手上次验证6 天前