ULVAC

NE- 5700

NE-950EX

NE 5500

NE 7000

The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.

ENVIRO

ENVIRO OPTIMA

NE-950

NLD-6000

NE-700

The NE-550EXa, a versatile high-density, low-pressure plasma etching system designed for exceptional uniformity and repeatability. Perfect for etching a wide range of materials, including III-V semiconductors, metals, ceramics, and optical components, it’s your ultimate solution for precision and performance.

NE-550EXa

NE-730

RISE 200

NE-950EXK

High density plasma etching for non-volatile materials.

NE-770

NE-950EX-V

NLD-570

FRE-200E

NE-550C

Euclid Theta-8000 RIE, rotating magnetron RIE metal etch.

EUCLID THETA-8000

UPE-2000-OSAP

NE-7700

Under high vacuum conditions, plasma is generated by RF high-frequency discharge, and under the action of bias voltage, specific materials are removed through physical and chemical effects. Etching materials: metal, GaN, In P, SiO2, Si, Polymide and other materials. Load-lock type, fully automatic control, patented ISM electrode, high uniformity, good stability, simple structure and easy maintenance.

ULVAC

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NE- 5700

NE 5500

NE-950EX

ENVIRO

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