说明
CU PLATING配置
CU PLATINGOEM 型号描述
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.文件
无文件
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
已验证
类别
PVD / Sputtering
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56163
晶圆尺寸：
12"/300mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
已验证
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56163
晶圆尺寸：
12"/300mm
年份：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
CU PLATING配置
CU PLATINGOEM 型号描述
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.文件
无文件