概述

SABRE Max is a product in Lam’s SABRE ECD product family, which offers the precision needed for copper damascene manufacturing on the industry’s productivity-leading platform. It is designed to meet the challenges of electrochemical deposition of copper, including providing void-free fill, low defects, low resistivity, and the ability to fill high aspect ratio structures while delivering high-productivity performance. SABRE Max offers high-throughput, void-free fill with superior defect density performance for advanced technology nodes and has the widest process window and highest rates of bottom-up growth to fill the most challenging HAR features. It is used for logic and memory interconnect applications.