说明
无说明配置
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM 型号描述
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.文件
无文件
STS
MULTIPLEX ICP
已验证
类别
Etch/Asher
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
64816
晶圆尺寸：
6"/150mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STS
MULTIPLEX ICP
已验证
类别
Etch/Asher
上次验证： 14 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
64816
晶圆尺寸：
6"/150mm
年份：
2001
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Model = MESC Multiplex ICP ASE Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch) Description of Process = ASE (Advanced Silicon Etch, Bosch Process) Wafer Size = 150mm Loader capacity = 2 wafer Carousel Chuck Type = Mechanical Weighted Clamp Process Gases: C4F8 = 300 Sccms SFG = 600 Sccms O2 = 100 Sccms AR = 100 Sccms Turbo Pump = Leybold Mag 2000 CT RF Generator 1 = ENI ACG-3 RF Generator 2 = AE RFG 3001 (Advanced Energy) Vacuum measurement = MKS Instruments Gate Valve = VAT Throttling Gate Valve Slit Valve = Vat Slit Valve Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue Vacuum Pump Loadlock = Edwards Pump E2M40 Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface) Chiller = Affinity, PWG-060K-BE33CBC2OEM 型号描述
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.文件
无文件