说明
OXIDE ETCHER配置
ETCHOEM 型号描述
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.文件
无文件
TEL / TOKYO ELECTRON
UNITY II-855II
已验证
类别
Plasma Etch
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
45977
晶圆尺寸：
8"/200mm
年份：
1996
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY II-855II
已验证
类别
Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
45977
晶圆尺寸：
8"/200mm
年份：
1996
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
OXIDE ETCHER配置
ETCHOEM 型号描述
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.文件
无文件