概述

Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm)　(Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000