UltraFLEX-XC is a 36-slot test system that offers three different test heads to optimize capital investment, footprint, and maximum number of instruments. All three test heads can use the same DIB (Device Interface Board), ensuring application portability and efficient instrumentation reuse and production flexibility. The test heads have a universal slot architecture, allowing any instrument to be placed in any slot.

Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.

UFLEX-XC

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