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市场 > Flip Chip Bonders > BESI / ESEC
制造商

BESI / ESEC

概述

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

活动的上架物品

5

总产品

3

服务

检验、保险、评估、物流

热门 BESI / ESEC Flip Chip Bonders

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