概述

The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.