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VITRION S 5000
类别
Laser概述
Glass wafer thickness: 0.3 to 3 mm Bridge tool: 150/200 mm wafer or 200/300 mm wafer EFEM: Two standard FOUPs Compatible with flat/notch wafers SECS/GEM for simple integration and configuration SEMI E84 System dimensions (W x H x D): 1800 x 2200 x 3000 mm
活动的上架物品
2
服务
检验、保险、评估、物流
