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LD 500
类别
Laser概述
-Green laser -Drilling, marking, structuring and ablation of free forms -Substrate thickness from 0.3mm to 50.0mm -Exactly right-angled machining -Chamfering possible during the drilling process -High yield with high accuracy -Space-saving stand-alone unit with simple user interface -integrated suction
活动的上架物品
1
服务
检验、保险、评估、物流
