说明
possible exposure to Gold配置
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 型号描述
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.文件
无文件
VEECO / ULTRATECH
AP300
已验证
类别
Lithography
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
18575
晶圆尺寸：
12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
VEECO / ULTRATECH
AP300
已验证
类别
Lithography
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
18575
晶圆尺寸：
12"/300mm
年份：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
possible exposure to Gold配置
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 型号描述
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.文件
无文件