说明
Photoresist alignment exposure machine配置
无配置OEM 型号描述
The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.文件
无文件
VEECO / ULTRATECH
AP200
已验证
类别
Lithography
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112615
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
VEECO / ULTRATECH
AP200
类别
Lithography
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112615
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Photoresist alignment exposure machine配置
无配置OEM 型号描述
The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.文件
无文件