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APPLIED MATERIALS (AMAT) CENTURA SINGEN
    说明
    Applied Materials Centura SiNgenPlus Low Pressure Chemical Vapor Deposition Furnace
    配置
    3 chambers SiNgen, 2 orienter/ EMP cool downThermal Nitride
    OEM 型号描述
    Silicon Nitride Deposition - Applied offers a single-wafer, high-temperature system to deposit silicon nitride films, called the SiNgen™ Centura. This system operates at a lower deposition temperature than conventional methods to minimize the amount of time the wafer is exposed to high temperatures and to reduce particles while improving many areas of operating cost and productivity in critical transistor nitride layers for sub-0.18 micron devices.
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    APPLIED MATERIALS (AMAT)

    CENTURA SINGEN

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    已验证

    类别
    LPCVD Poly

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Parts Tool


    运行状况:

    未知


    产品编号:

    93181


    晶圆尺寸:

    未知


    年份:

    2000

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    Logistics Support
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    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    APPLIED MATERIALS (AMAT) CENTURA SINGEN

    APPLIED MATERIALS (AMAT)

    CENTURA SINGEN

    LPCVD Poly
    年份: 0状况: 二手
    上次验证昨天

    APPLIED MATERIALS (AMAT)

    CENTURA SINGEN

    verified-listing-icon
    已验证
    类别
    LPCVD Poly
    上次验证: 30 多天前
    listing-photo-c4189ac822f84e8e90dc781b8c65f20e-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Parts Tool


    运行状况:

    未知


    产品编号:

    93181


    晶圆尺寸:

    未知


    年份:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Applied Materials Centura SiNgenPlus Low Pressure Chemical Vapor Deposition Furnace
    配置
    3 chambers SiNgen, 2 orienter/ EMP cool downThermal Nitride
    OEM 型号描述
    Silicon Nitride Deposition - Applied offers a single-wafer, high-temperature system to deposit silicon nitride films, called the SiNgen™ Centura. This system operates at a lower deposition temperature than conventional methods to minimize the amount of time the wafer is exposed to high temperatures and to reduce particles while improving many areas of operating cost and productivity in critical transistor nitride layers for sub-0.18 micron devices.
    文件

    无文件

    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) CENTURA SINGEN

    APPLIED MATERIALS (AMAT)

    CENTURA SINGEN

    LPCVD Poly年份: 0状况: 二手上次验证: 昨天