EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.

EVGroup (EVG)

EVG620

The EVG®6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.
Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput, advanced alignment features and optimized total cost of ownership. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG6200 NT or the fully-housed EVG6200 NT Gen2 mask alignment systems are available in semi-automated or automated configuration and equipped with integrated vibration isolation to achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

EVG6200 NT

EVG640

H-line system with double-sided mask alignment capabilities

EV420

Double sided alignment system that incorporated high precision back system alignment

EV620

The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.

EVG6200-Infinity

"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s
configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force
capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy.
Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both
soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."

IQ ALIGNER

EVG620 NT Gen2

The EVG610 is a versatile lithography system that supports various standard processes including vacuum, hard, soft, and proximity exposure modes, with an added feature of back-side alignment. It also provides extra capabilities such as bond alignment and nanoimprint lithography (NIL). The system is designed for quick processing and easy reconfiguration to meet changing requirements, boasting a conversion time of just a few minutes. Its user-friendly design caters to all skill levels, from beginners to experts, making it an excellent choice for universities and R&D applications.

EVG610

The IQ Aligner® NT is an automated mask alignment system up to 300mm. It optimized for zero-assist contactless proximity processing at highest throughput. The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

IQ ALIGNER NT

SmartNIL

EVG6200 NT Gen2

The EVG®620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.
Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. It is an ideal tool for optical double-side lithography available in semi-automated or automated configuration with optional full-housing Gen 2 solution to meet high-volume production requirements and fab standards. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG620 NT or the fully housed EVG620 NT Gen2 mask alignment systems are equipped with integrated vibration isolation, and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

EVGroup (EVG)

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热门 EVGroup (EVG) Mask Aligner

EVG620

EVG6200 NT

EVG640

IQ ALIGNER

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