说明
TB Manual Mask Aligner配置
Topside Alignment (TSA) Backside Alignment (BSA) Manual Handling Manual Controlled Stage Wafer Size: up to 6"/150mm Objectives: 10x (top and backside) Tooling Tray Uniformity Test Plate EVG 620 offers Proximity, Soft Contact, Hard Contact or Vacuum Contact Exposure Modes Tooling Exchanges are Quick, Simple and can be Performed Within Minutes Lamphouse: 350W Lamphouse (Optional: 500W / 350W or LED Upgrade Upon Request) Exposure Optics: Type C, 350nm - 450nm, Broadband Microsoft Windows based User Interface System PC, Keyboard, Cables PDF Manual for EVG 620OEM 型号描述
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文件
无文件
EVGroup (EVG)
EVG620
已验证
类别
Mask Aligner
上次验证： 今天
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
93296
晶圆尺寸：
6"/150mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
EVGroup (EVG)
EVG620
类别
Mask Aligner
上次验证： 今天
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
93296
晶圆尺寸：
6"/150mm
年份：
2001
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
TB Manual Mask Aligner配置
Topside Alignment (TSA) Backside Alignment (BSA) Manual Handling Manual Controlled Stage Wafer Size: up to 6"/150mm Objectives: 10x (top and backside) Tooling Tray Uniformity Test Plate EVG 620 offers Proximity, Soft Contact, Hard Contact or Vacuum Contact Exposure Modes Tooling Exchanges are Quick, Simple and can be Performed Within Minutes Lamphouse: 350W Lamphouse (Optional: 500W / 350W or LED Upgrade Upon Request) Exposure Optics: Type C, 350nm - 450nm, Broadband Microsoft Windows based User Interface System PC, Keyboard, Cables PDF Manual for EVG 620OEM 型号描述
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文件
无文件