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EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
说明
IQ Aligner / Semi-Automated Top side Nano imprint Lithography System for 200mm Wafer
配置
无配置
OEM 型号描述
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."
文件

无文件

PREFERRED
 
SELLER
类别
Mask/Bond Aligners

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

13909


晶圆尺寸:

8"/200mm


年份:

2015


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

EVGroup (EVG)

IQ ALIGNER

verified-listing-icon
已验证
类别
Mask/Bond Aligners
上次验证: 60 多天前
listing-photo-8PAWOrTwRVNtcreh1T8zyH05LfsTdSZwYa2egiOOzsI-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

13909


晶圆尺寸:

8"/200mm


年份:

2015


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
IQ Aligner / Semi-Automated Top side Nano imprint Lithography System for 200mm Wafer
配置
无配置
OEM 型号描述
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."
文件

无文件