概述

The Karl Suss BA 6 bond aligner can be used for processing of wafers from 2" to 150mm. The Karl Suss BA 6 is designed for all standard lithography applications and wafer sized up to 150mm. The Karl Suss BA 6 also offers high resolution and optimum edge quality for thick-resist MEMs applications, and features tailored to III-V compounds, thin or warped wafers, tranparent substrates, or single dies. Mask/Bond Aligner