说明

1 SUSS MA8 MASK ALIGNER /WD-33/MAN 2 ALIGNMENT STAGE MA/BA6-8/WD-33/MAN/A-200 /MAN (mounted on Machine) 3 ENHANCED IMAGE STORAGE SYSTEM (EISS 2.0) FOR MA8/BA8 (mounted on Machine) 4 SUSS DVM8 MICROSCOPE MA8/BA8 , CPL. Incl. Cable 5 OBJECTIVE UMPL FL 5X/0.15 6 OBJECTIVE LMPLFL 10X/0.30 7 OBJECTIVE LMPLFL 20X/0.40 8 SET OF TURRETS FOR 3 OBJECTIVES (mounted on DVM6/8) 9 LED LSB-W200 EXPOSURE SYSTEM 10 CHUCK MA8/BA6/BSA/CONT/W-200 11 ADAPTER KIT FOR MH MA8/BA6/AA-33 - mounted on AL.STAGE) 12 MASK HOLDER MA8/BA6/BL/PROX/CONT/M-9/TH-3-6.5/W-200 13 SUSS UV OPTOMETER CASE CPL. 14 SUSS UV LIGHT MEASURING PROBE 365/405NM for UV OPTOMETER 15 EXPOSURE TEST DIAL 200MM 16 UV EYE PROTECTION GLASSES ACCESOIRES: MONITOR incl. CABELSET 6-FACH STECKDOSE , KEYBOARD, FOOTSWITCH, ADAPTER EISS2.0 SAFETY AND INSTALLATION MANUAL MA6-8/BA6, MQS-EISS2.0 MANUAL,USB-BACKUP MA8BA6 COVER left HOSE SET LABORATORY-ALIGNER and 5 pieces T-Connection 1/4" MASK HOLDER SHELF WITH MATCHING SCREWS TRANSPORT SAFETY SET BOX-VERPACKUNGSKISTE 144X177X215

配置

无配置

OEM 型号描述

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production. MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications. After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies: Bond alignment near-field holographic lithography , UV processing UV curing nanoimprinting, etc.