概述

This mask aligner provides high resolution photolithography and can process samples in a variety of shapes and sizes. The KARL SUSS MJB 3 UV400 processes wafers up to 3” in diameter and its resolution can reach 1-2 microns. Configuration includes 350W mercury short-arc lamp, high precision stage with alignment accuracy up to 0.25 microns, high resolution contact exposure mode, high precision alignment with microscope manipulator, and special substrate chucks for irregular materials, thick substrates, and hybrids.