Screen Semiconductor offers a variety of products throughout the semiconductor manufacturing processes: Screen offer tools for the following processes: Wafer cleaning system, measurement system, coat/develop track, inspection system, annealing system, and advanced packaging lithography.

LAMBDA ACE VM-2200
The VM-2200/3200 series offers high throughput of up to 160 wafers per hour in high-speed mode (during five-point measurement of SiO2 wafers).

SCREEN / DNS / DAINIPPON SCREEN

VM-2200

Measurement system – Spectroscopic film thickness measurement systems (embedded type)

STM-602-S	

Measurement systems – Spectroscopic film thickness measurement systems (manual type)


VLM-8000

systems – Spectroscopic film thickness measurement systems (fully automatic type)

VM-8200

VM-2010

LAMBDA ACE VM-1200
A desktop model that can be incorporated into production lines.

VM-1200

Spectroscopic film thickness measurement systems (semi-automatic type)

STM-603-PS

Measuring system - Spectroscopic film thickness measurement systems (fully automatic type).

VL-M8000-LS

Measuring Equipment --Measuring Equipment --Optical Interference Film Thickness Measuring Systems (for FPD) Measurement systems – Spectroscopic film thickness measurement systems (for FPD)

STM-1601-P

UVM-8000

Measurement Systems-Spectroscopic trench measurement systems

SDM-601

Wafer size 100mm ~ 300mm
High-speed mode achieves a high throughput of 160 WPH, optimal for multipoint measurement of communications devices and other products.

VM-2500

Measurement systems – Spectroscopic film thickness measurement systems (embedded type)

VM-8000J-C

VM-8000J-F

STM-1603-P

Measuring system – Spectroscopic film thickness measurement systems (semi-automatic type)

STM-602-PL

Spectroscopic film thickness measurement systems (semi-automatic type).

STM-602-PS

VM-210E

Measuring Instruments- Non-contact CV measurement system

CV-3000

Measurement systems – Spectroscopic film thickness measurement systems (manual type)

VM-8000J

VM-300E

Spectroscopic film thickness measurement systems (fully automatic type)

STM-651-ML

Spectroscopic film thickness measurement systems (fully automatic type)


UV-M8100

STM-602-PLS

VM-201E

VM-1000

STM-651-S

STM-803-P

Measuring system – Spectroscopic film thickness measurement systems (fully automatic type)

VL-M8100

STM-1601

STM-602

LAMBDA ACE VM-1300
A desktop model that can be incorporated into production lines.

VM-1300

Measuring Equipment --Measuring Equipment --Optical Interference Film Thickness Measuring Systems (for FPD) Measurement systems – Spectroscopic film thickness measurement systems (for FPD)


VL-M1800-S

LAMBDA ACE VM-3200
The VM-2200/3200 series offers high throughput of up to 160 wafers per hour in high-speed mode (during five-point measurement of SiO2 wafers).

VM-3200

SDM-601-PLS

STM-603-PLS

SD-M803-PLS

STM-603-P

Spectroscopic film thickness measurement systems (fully automatic type).

VLM-6100

VM-3110

LAMBDA ACE VM-1020
Wafer size 50mm ~ 300mm
Microscope model that is ideal for R&D. 

VM-1020

VM-200E

ST-M602J

Measuring systems – Spectroscopic film thickness measurement systems (fully automatic type).


VM-2000

VL-M6000-LS

VL-M6000-S

STM-602-JEX

Measuring systems – Spectroscopic film thickness measurement systems (fully automatic type)

VM-3000

VL-M8000-S

STM-602-L

Non-contact CV measurement systems-Measurement systems

CV-8000

Spectroscopic film thickness measurement systems (manual type)

ST-M802J

CV-8000-L	

SDM-603-PLS

VM-1100

VLM-6000

LAMBDA ACE VM-1030
Spectroscopic Film Thickness Measurement System
Microscope model that is ideal for R&D

VM-1030

VL-M6000-FP

UM-8200

STM-602-P

Wafer size 100mm ~ 300mm
High-speed mode achieves a high throughput of 160 WPH, optimal for multipoint measurement of communications devices and other products. The VM-3500 can be optionally equipped with a trench measurement mechanism, enabling it to measure both film thickness and trench depth.

SCREEN / DNS / DAINIPPON SCREEN

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VM-2200

VM-2010

VM-1200

VM-8200

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