FSM / FRONTIER SEMICONDUCTOR

FSM-128

8800

500TC

128NT

900TC

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

FSM127

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

413 C2C

Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading and retrieval.

FSM-128L

AQUAFLEX

Micro Raman system  for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling.  Fully automated C2C system.

FSM / FRONTIER SEMICONDUCTOR

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热门 FSM / FRONTIER SEMICONDUCTOR Metrology

FSM-128

8800

500TC

413 C2C

使用 Moov 上架，立即找到完美买家。

全部 FSM / FRONTIER SEMICONDUCTOR Metrology