MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

KLA / MICROSENSE

6033

The Model 6033T, using ADE’s patented capacitive measurement principle, measures wafers for Thickness and Total Thickness Variation (TVV). Whenever semiconductor wafer inspection is required, the MicroSense Model 6033T offers a low cost method of achieving fast, accurate measurements on wafers up to 150mm in diameter. 

6033T

The MicroSense Model 5810 is a single channel, non-contact precision capacitive displacement sensor. Designed for high dynamic applications, the Model 5810 provides high resolution with measurement bandwidth up to 100 kHz.

5810

The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter. 

6034

The Model 6810 high resolution capacitive sensor offers state-of-the art performance for position and displacement measurement. The 6810 is designed specifically for "high dynamic" measurement of high speed rotating or oscillating targets such as precision Hard Disk Drive spindle motors, precision air bearing spindles and mechanical bearing machine tool spindles.  Applications include run out measurement such as axial and radial NRRO (non-repeatable run out or asychronous error motion) which require resolution of 1 to 2 nm-rms or better.

The 6810 is electrically compatible “drop in” replacement for users who wish to upgrade from existing 5810 systems – no design changes are required.
 
The 6810 is ideal for use with our SpinCheck Metrology System – The 6810 is 100% compatible with existing and new SpinCheck systems. Existing SpinCheck customers can typically improve measurement resolution by 2X to 5X by upgrading to 6810 demodulators modules and 6000 series probes.

6810

Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.
Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.

UltraMap-200B

Precise Automated Measurement for High Volume Silicon Wafer Manufacturing 
The MicroSense® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.

C200L

Single channel, 3U high Eurocard for rack mounting

5800

8800

The MicroSense® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.

C200M

Automated Wafer Thickness Measurement System
IR interferometry probe technology. Single or dual probes.

Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.

Wafer 4" to 12" (100 to 300mm) round or square.

 UltraMap-300IR

The MicroSense Mini is a compact, high resolution linear displacement sensor designed specifically for providing servo system feedback, especially for OEM applications.

MINI

Replaced by Model 8810
The 3800 OEM gaging module is a non-contact capacitive dimensional gaging system designed for maximum flexibility combined with ease of use.  Capacitive transduction converts variations in a probe-to-target distance into an electrical signal.

3800

Single channel, low profile (no meter) stand alone sensor with external low noise power supply.

4805

Single channel, 3U high Eurocard for rack mounting.

4800

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes includes 2D stress option.
Automatic, non-contact measurement of filmed, patterned and bare wafers, 150mm & 200mm diameter.

The MicroSense STR1 measurement system provides full wafer, high speed geometry measurements of semiconductor wafers using  non-contact capacitance sensors with nanometer level thickness resolution. The system measures the thickness, flatness, bow and warp of the wafer in compliance with SEMI standards. MicroSense StressMap software provides accurate measurement of wafer stress based on high resolution wafer pre-and post deposition shape data. Over 120,000 data points are measured on each wafer to generate  high resolution wafer maps.

STR1

The Model 6360 CD-HR Stamper Thickness Measurement System is a semi-automated thickness gauging platform and data analysis system for the measurement of optical media stampers. Patented non-contact capacitive sensors determine the stamper thickness without any damage to the stamper. A personal computer is provided to run the gauging platform, acquire measurement data and display results.

6360 CD-HR

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes. 
Automatic, non-contact measurement of filmed, patterned and bare wafers -150mm & 200mm diameter

The MicroSense® CSW1 is formerly known as the UltraMap UMA-C200. The MicroSense CSW1 measurement system provides full wafer, high speed geometry measurement of semiconductor wafers using non-contact capacitance sensors with nanometer level thickness resolution. The system measures the thickness, flatness, bow and warp of the wafer in compliance with SEMI standards. Designed for maximum versatility, the system can measure 150mm and 200mm diameter wafers.  Over 120,000 data are measured on each wafer to generate high resolution wafer maps.

CSW1

MicroSense PV-6060 Non-Contact Photovoltaic Wafer Thickness, TTV and Resistivity Measurement Module.
5 mm diameter sensors are used for thickness measurement, providing high spatial resolution and measurement close to wafer edge.

PV-6060

Make automatic, non-contact measurement of thickness, flatness and shape of wafers up to 4" diameter with this compact system.

UltraMap-100

Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping. 

Wafer 4” to 12” (100 to 300mm)

 UltraMap-300

The MicroSense II Model 5300 provides up to 4 independent, non-contact position measurement sensors in a single, easy to carry console. You choose the number of measurement channels needed for your application – additional channels can be added as required.

MSII 5300

The MicroSense UltraMap-TSV (Through Silicon Via) system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.

 UltraMap-TSV

The MicroSense® BP1 is formerly known as the UltraMap UMA-200-BP. The MicroSense BP1 wafer measurement system precisely measures wafer thickness, flatness and shape using two patented, noncontact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement – the BP1 measures sawn, lapped or polished wafers. 

The MicroSense model 8810 is a non-contact precision position sensor. The 8810 is designed for best linearity and stability, with measurement bandwidth up to 20 kHz – ideal for servo system position feedback and fast tool servo applications.

8810

ADE’s Model 6035 uses non-contact eddy-current probes to accurately measure Bulk Resistivity of wafers. This MicroSense system handles wafers up to 150mm in diameter, and is useful in the laboratory for materials research or on the production line for quality, process control, and yield analysis. 

6035

The MicroSense model 4810 is a non-contact precision position sensor. The 4810 is optimized for short range displacement measurement applications that require best possible linearity and stability. 

Single channel, stand alone sensor with external low noise power supply

KLA / MICROSENSE

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6033

6033T

5810

6034

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