KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

The Prometrix UV-1050 system is designed for thin film measurement applications and features advanced reflective optics, broadband UV technology, enhanced algorithms for advanced measurements, reflectivity and Gamma curve capability, and spectral analysis software for greater accuracy and repeatability.

UV-1050

FT-750

The Prometrix RS55 is a four-point probe resistivity mapping system manufactured by KLA-Tencor. It has a temperature compensation configuration (RS55/TC) and can handle wafers up to 8"/200mm in size. It has manual wafer handling and can provide contour maps, 3-D plots, and diameter scans. It can also compensate sheet resistance measurements against ambient temperature and materials.

RS55

The Prometrix UV-1280SE is a production thin film measurement system that combines dual-beam spectrophotometry and broadband spectroscopic ellipsometry. It can directly measure film thickness, refractive index, and extinction coefficient of single- and multi-layer thin film stacks simultaneously. The system is easy to use, lowers cost of ownership, and increases production efficiency. It is useful for both process control and advanced materials development.

UV-1280SE

FLX 2908

The SpectraShape 8660 and 8810 optical CD and shape metrology systems. The new SpectraShape systems fully characterize and monitor the critical dimensions and three-dimensional shapes of geometrically complex features incorporated by some IC manufacturers in their latest generation devices.

 SpectraShape 8660 

5100

RS55/TCA

The Archer 200 is an optical overlay control system designed to meet the performance and cost-of-ownership requirements for advanced design rules, including 32nm and double-patterning lithography. It features major improvements to its core optical design and an optional scatterometry measurement technology. This system offers tighter total measurement uncertainty, increased flexibility, higher productivity, and faster measurement. It uses industry-standard AIM or smaller µAIM targets.

ARCHER 200

MPV CD2 AMC

The ASET-F5x is a thin film metrology system that can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm. It accurately measures complex multi-layer thin film stacks using spectroscopic ellipsometry and precisely measures advanced, ultra-thin gate dielectric films. It provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small as 0.1 micron. Its applications include diffusion films/film deposition, CMP, lithography, and etch.

ASET-F5x

The Archer 300 LCM is a high-performance, low-cost metrology system for 2Xnm logic and 1Xnm half-pitch memory devices. It offers precision, fast measurement speed, and in-field metrology capability. Improvements to the imaging-based optical subsystem result in better overlay measurement specifications than the previous-generation Archer 200. The system provides cost-effective characterization of overlay error and CD on lithography process layers for double patterning and other advanced technologies. It is also seamlessly integrated with K-T Analyzer, an advanced data analysis system, and Recipe Database Manager (RDM), a centralized database of production-proven recipe components. The Archer 300 LCM is suitable for double patterning technologies, scanner qualification, and in-line monitoring.

ARCHER 300

The Prometrix RS55/tc is a four-point probe resistivity mapping system manufactured by KLA-Tencor. It has a temperature compensation configuration (RS55/TC) and can handle wafers up to 8"/200mm in size. The system provides contour maps, 3-D plots, and diameter scans, and can compensate sheet resistance measurements against ambient temperature and materials.

RS55/TC

The Archer AIM+ is an advanced optical overlay metrology tool that sets the standard for lithography process control through the > 45-nm node. It improves yield and cost of ownership with a 20% increase in throughput over previous-generation solutions. It features field-proven AIM grating-style technology, improved optics design, and high accuracy measurements. Its applications include overlay metrology, CMP, lithography, and wafer surface focus and analysis.

ARCHER AIM+

The Archer 500 is a high-performance overlay metrology system for advanced patterning processes. It offers improved precision, measurement speed, and meets strict specifications for overlay error on multi-patterning lithography layers. The Archer 500 utilizes an innovative multi-layer target to provide precise, fast feedback on overlay error. Improvements to the optical subsystems and platform result in better overlay measurement specifications than the previous-generation Archer 300. New illumination options enable overlay measurement capability on a wide range of lithography layers. The Archer 500 is suitable for multi-patterning technologies, in-line monitoring, and scanner qualification. It seamlessly integrates with K-T Analyzer and Recipe Database Manager to improve fab productivity.

ARCHER 500

The Tencor FLX-2320 is an equipment that accurately measures film stress at temperatures from -65°C to 500°C, using dual wavelength technology to work on all types of films, including transparent ones like silicon nitride. This helps better understand film properties in simulated process environments.

FLX 2320

Archer AIM is an Advanced Optical Overlay Metrology product that improves stepper correction accuracy, provides precise data, and enables design rule segmentation. It delivers industry-leading precision performance, reduces total measurement uncertainty, and increases sampling rate. It also includes offline automatic recipe creation and real-time analysis software. The MPX option enables ‘on product’ monitoring of focus-exposure. Archer AIM targets new standards for lithography process control for 65-nm and beyond, reducing measurement uncertainty and enabling control of overlay error budgets. It integrates with KLA-Tencor’s software management products to provide comprehensive optical overlay metrology process control.

ARCHER AIM

The Prometrix UV-1250SE Thin Film Measurement System is a tool that can measure film thickness, refractive index, extinction coefficient, and goodness-of-fit of single or multi-layer thin film stacks. It combines spectroscopic ellipsometry and broadband UV spectrophotometry for non-destructive optical characterization. This results in greater productivity and tighter process control.

UV-1250SE

QUANTOX 64100

ERGOLUX

The OmniMap® RS75/tc is a resistivity mapping system designed to help semiconductor manufacturers perform accurate wafer characterization and critical production monitoring at substantially greater speeds. It addresses a wide variety of process applications where film thickness and sheet resistance are critical, such as ion implantation, metallization, diffusion, epitaxy and polysilicon. The RS75/tc model incorporates a patented temperature compensation (tc) solution, allowing the system to correct for temperature variations, dramatically affecting long-term repeatability, accuracy, and system-to-system matching. With measurement speed of approximately 1 second per test site, the tool can process a 25-slot cassette of 200mm wafers at over 100 wafers per hour. This includes five-site monitoring, with automatic temperature compensation and flat alignment. The RS75 series is offered in a variety of configurations to meet customer production requirements.

RS75/tc

FX200

MPV-CD

SM200/e

The KLA-Tencor 5200XP is an automated overlay metrology tool for the semiconductor industry. It improves overlay control, maximizes lithography tool utilization, and meets the requirements of 0.18 µm design rules. It has the highest throughput in the industry and is compatible with current factory automation standards.

5200XP

the ASET-F5, our third generation spectroscopic ellipsometer, which addresses the difficult film measurement needs that come from the continuing evolution of film development driven by shorter line widths. These new films demand an increasing capability to characterize and control them in production, a capability provided by the ASET-F5.

ASET-F5

6020

50-03000	

The Archer 100 optical overlay control system is a cost-effective and high-performance solution for advanced design rules and immersion lithography. It has a lower total measurement uncertainty, improved tool utilization, and is extendible to address future lithography challenges. It also features automatic recipe optimization to minimize human error and free up fab resources.

ARCHER 100

The KLA 5200 is an overlay metrology system that helps chipmakers improve process control and reduce time to market for advanced products with feature sizes down to .18 µm. It uses Coherence Probe Microscopy (CPM) to identify surfaces and can measure all layers, including low-contrast or grainy targets. The KLA 5200 can lower stepper cost-of-ownership by providing high-quality data to prevent lithography process errors, helping manage the overlay budget and maximizing lithography output.

5200

ARCHER 300+

FLX 2320A

The Archer 10XT+ is a semiconductor manufacturing tool that features a 300mm wafer. It boasts a long-term precision improvement of 66% compared to its predecessor, the A10. In terms of performance, the Archer 10XT+ has a MAM (Mean Average Measurement) time of 1.35 seconds. It can process 150 wafers per hour (WPH) and 29 lots per hour (LPH) when using a 300mm FOUP (Front Opening Unified Pod).

ARCHER 10 XT+

Quantox® is a metrology system designed to measure the electrical performance of gate dielectric films in integrated circuits. The quality of the gate dielectric is crucial for the speed and reliability of the circuit. By measuring key parameters such as contamination levels and oxide thickness, Quantox® helps to control the gate dielectric process and maximize device yield. The system is non-contact, ensuring accurate and reliable measurements.

QUANTOX

The RS-100 is a production-worthy resistivity measurement system used in nearly all fabs worldwide. It provides advanced automation and improved edge performance for 300mm wafers. It has accurate and repeatable resistivity measurements up to 1mm from the conductive film edge, patented temperature compensation, and easy-to-use software. It is used in metal deposition, CMP, ion implantation, and diffusion. Its enhanced edge performance provides greater insight into process control variance and lowers cost-of-ownership.

RS100

ARCHER 700

5300

SpectraCD 200

The OmniMap® RS75 series is a tool designed to help semiconductor manufacturers perform accurate wafer characterization and critical production monitoring at substantially greater speeds. It addresses a wide variety of process applications where film thickness and sheet resistance are critical. The RS75/tc model incorporates a patented temperature compensation (tc) solution, allowing the system to correct for temperature variations, dramatically affecting long-term repeatability, accuracy, and system-to-system matching. The RS75 series is offered in a variety of configurations to meet customer production requirements, including automated and manual versions, both of which are available with or without temperature compensation. Models include the Auto RS75/tc, RS75/tc, Auto RS75, and the RS75.

RS75/TCA

M-GAGE 200

RS35

FT-650

In February 2006, KLA introduced the SpectraCD-XT—our fourth-generation of inline optical CD metrology systems for advanced patterning process control at the 90nm and 65nm nodes. SpectraCD-XT is a non-destructive dedicated CD and profile metrology system built on our high-throughput, production-proven Archer platform. The tool is the only high performance spectroscopic ellipsometry (SE)-based

SpectraCD-XT

SM-300

M-GAGE 300

The Archer 10XT is an Automated Optical Overlay Metrology product that enables control of overlay error budget for sub-90-nm production. It provides a significant increase in throughput, precision, and TIS variability over previous generation systems. The system is user-friendly and has a competitive cost-of-ownership for 300-mm manufacturing at the sub-90-nm node. It integrates with KLA-Tencor’s software management products to provide comprehensive optical overlay metrology process control.

ARCHER 10 XT

UV-1080

UV-1270

Overlay registration, 65 wafers per hour (8-inch wafers), 5nm resolution, 7.5nm repeatability.

5011

The SpectraShape 9000 utilizes an array of optical technologies and a new high intensity light source to characterize and monitor the critical dimension (CD) and shapes of 3-D transistors, memory cells and other complex features used in high-performance IC devices.

SpectraShape 9000

ARCHER 200+

The SpectraShapeTM 8660 and 8810 optical CD and shape metrology systems. The new SpectraShape systems fully characterize and monitor the critical dimensions and three-dimensional shapes of geometrically complex features incorporated by some IC manufacturers in their latest generation devices.

SpectraShape 8810

FLX 5200

SpectraCD system, introduced in June 2001, provides non-destructive simultaneous and extensive CD, feature shape, and film-thickness measurements from a single tool, making it one of the industry's lowest cost-of-ownership, production-worthy CD metrology systems for 193nm lithography applications and sub-100nm device production.

SpectraCD

UV-1050SE

Sheet Resistance Measurement Systems

The OmniMap® RS-200 resistivity mapping system, based on proven industry resistivity mapping standards, provides accurate and reliable sheet resistance measurement for 45nm and beyond. This resistivity mapping system provides capabilities such as advanced automation and improved edge performance to meet today's 300mm wafer production requirements.

OmniMap RS200+

The OmniMap RS75 is a four-point probe series that offers precise sheet resistance measurements for monitor wafers. It is faster than existing systems and is suitable for a variety of semiconductor process monitoring applications, including ion implantation, metal deposition, CMP, diffusion, polysilicon, epi, RTP, and bulk silicon. The system can process over 100 wafers per hour when conducting a five-site test on 200 mm wafers, with temperature compensation and flat alignment. A 49-site contour map with temperature compensation can be completed on a manually loaded test wafer in less than sixty seconds. This makes the OmniMap RS75 a production-worthy tool for sheet resistance mapping.

RS75

 The SpectraFilm LD10 system utilizes a laser-driven plasma light source to produce reliable, high-precision film measurements for a broad range of film layers, including the thin, multilayer film stacks used in forming complex device structures such as FinFETs. An infrared-based subsystem on the SpectraFilm LD10 enables characterization of thick films and film stacks, such as those found in 3D NAND flash devices.

SpectraFilm LD10

UV-1270SE

To help achieve sub-3nm overlay error for advanced logic and memory devices KLA introduced the Archer 600 imaging-based overlay metrology system. New optics in combination with innovative ProAIM targets deliver better resilience to process variations and improved correlation between measurement target and actual device pattern overlay errors, producing more accurate overlay measurements.

ARCHER 600

RS50/E

The ASET-F5X Pro film metrology system provides reliable, affordable and high precision thin film measurements of film thickness, refractive index, and bow/stress capability across a broad range of f ilm stacks and geometries.  The system features capabilities that provide absolute accuracy, reproducibility and system-to-system matching required for fabs that manufacture devices for the IOT, automotive and mobile markets. The ASET-F5x Pro integrates precise optical spectroscopic ellipsometry and reflectometry metrology technologies in a single system to manage the full range of thin film measurement challenges required by µLED, MEMs and IC manufactures.  

ASET-F5x Pro

5015XP

UV-1280

SpectraCD XTS

RS30

FX100

Quantox XP is an in-line, real-time electrical monitoring and characterization tool that enables advanced gate formation for sub-130 nm devices. It provides better than 95% correlation to device electrical test data and allows non-contact electrical test measurements of key transistor gate parameters. ACTIV technology features highly accurate, comprehensive data on physical and electrical properties of advanced gate dielectric materials. Quantox XP offers a complete gate monitoring solution for today’s advanced gate dielectric processes. It also provides comprehensive films metrology control using optical and electrical topography measurements.

QUANTOX XP

FLX-5500

RS75A 

The Tencor FLX-5400 is an automated wafer handling system that uses patented dual wavelength technology to create 2D and 3D maps of radial stress. It has a unique calibration algorithm and automatic substrate thickness determination for enhanced measurement accuracy.

FLX 5400

The SpectraShape™ 11k dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of finFETs, vertically stacked NAND and DRAM structures, and other complex features on integrated circuits at leading-edge design nodes. Using significant advancements in optical technologies and patented algorithms, the SpectraShape 11k identifies subtle variations in critical device parameters (critical dimension, high k and metal gate recess, side wall angle, resist height, hardmask height, pitch walking) across a range of process layers. With an improved stage and new measurement modules that enable high throughput operation, the SpectraShape 11k provides fast identification of process issues inline, helping fabs accelerate yield ramps and achieve stable production.

SpectraShape 11k

The SpectraFilm F1 film metrology system, introduced in September 2017, employs new optical technologies that determine single- and multi-layer film thicknesses and uniformity with high precision to monitor deposition processes in production, and deliver bandgap data that predict device electrical performance earlier than end of line test.

SpectraFilm F1

The Archer 750 were launched during the fiscal year ended June 30, 2020, which utilizes wavelength tunability to produce accurate overlay measurements. 

ARCHER 750

The SpectraShape 10K optical-based metrology system was introduced to measure the CDs and three-dimensional shapes of complex IC device structures following etch, chemical mechanical planarization (CMP) and other process steps. Several new optical technologies including a new high brightness light source illumination enable accurate measurements of critical parameters in FinFET and 3D NAND devices.

 SpectraShape 10k

UV-1070SE

VP 10

UV-1080SE

FLX 2320-S

RS35C

KLA unveiled SpectraCD 100—the next-generation inline optical CD metrology system for advanced patterning process control at the 90-nm and 65-nm nodes.  SpectraCD 100 utilizes a new hardware platform and advanced 3-D modeling capabilities to conduct complete profile measurements of yield-critical structures with a two-fold improvement in precision and tool-to-tool matching over our previous-generation SpectraCD system.  These capabilities, coupled with SpectraCD 100’s production throughput and ability to non-destructively measure features down to 30-nm, provide chipmakers with an effective inline process control and product dispositioning tool for their most critical patterning steps.

SpectraCD 100

RS50

SpectraCD XTR 

FLX 2320-R

The RS-200 is a resistivity mapping system that provides accurate and reliable sheet resistance measurement for 45 nm and beyond. It has advanced automation, improved edge performance, and is suitable for 300mm wafers. It has patented temperature compensation and easy-to-use software based on Windows XP.

RS200

The ATL100 (Accurate Tunable Laser) scatterometry-based overlay metrology systems, introduced in September 2017, utilize tunable laser technology to automatically maintain highly accurate and robust overlay error measurements in the presence of process variations, supporting fast technology ramps and wafer disposition during production.

ATL100

ASET-F5x SCD

5000

Archer 10 is an Automated Optical Overlay Metrology product that provides control of overlay error budget for sub-0.13-micron production, increases throughput by 30%, and allows consistent measurement of low-contrast targets. It integrates with KLA-Tencor’s software management products to provide comprehensive optical overlay metrology process control.

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