概述

Non-contact, fully automatic measurement provides outstanding throughput. Perfect for measuring FOUP and FOSB. Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments. SEMI-compliant kinematic plate provides perfect XYZ coordinates. Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes. Laser AF provides fast, non-contact measurements of wafer positions. Wide area, high-intensity LED illumination enables accurate measurements of wafer heights. 300mm, 200mm wafer carrier and SMIF Pod base.