说明
Wafer Substrate Bonding配置
无配置OEM 型号描述
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.文件
无文件
ASMPT
NUCLEUS
已验证
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
88866
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
NUCLEUS
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
88866
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Substrate Bonding配置
无配置OEM 型号描述
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.文件
无文件