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市场 > Packaging > BOSCHMAN > UNISTAR AUTO-2-FF-L

UNISTAR AUTO-2-FF-L

类别
Packaging
概述

Fully automatic 2-strip Film Assisted Molding system designed for advanced mems, sensors, power, qfn and bga packages. This system can work with lead frames, substrates and ceramic carriers as well as individual modules.

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