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SUSS MicroTec / KARL SUSS HVMMFT
    说明
    无说明
    配置
    Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers.  Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.
    OEM 型号描述
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    文件

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    SUSS MicroTec / KARL SUSS

    HVMMFT

    verified-listing-icon

    已验证

    类别

    Packaging
    上次验证: 60 多天前
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    15717


    晶圆尺寸:

    未知


    年份:

    未知

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    SUSS MicroTec / KARL SUSS

    HVMMFT

    verified-listing-icon

    已验证

    类别

    Packaging
    上次验证: 60 多天前
    listing-photo-dmyDmp8EaLokEu0LDSaJhzMB0_bDiZHADlb5e6PUOg4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/dmyDmp8EaLokEu0LDSaJhzMB0_bDiZHADlb5e6PUOg4/xMovEHXlfYbkgs7uoxMw8vqD72BEX52LjKdQEf3NZx8_20190301_114608_f
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    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    15717


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers.  Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.
    OEM 型号描述
    未提供
    文件

    无文件

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