DR 3000III
概述
Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.
活动的上架物品
1
服务
检验、保险、评估、物流
Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.
1
检验、保险、评估、物流
