说明
无说明配置
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM 型号描述
LASER文件
无文件
TEIKOKU
DXL 800HS
已验证
类别
Packaging
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17902
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEIKOKU
DXL 800HS
已验证
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17902
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM 型号描述
LASER文件
无文件
类似上架物品
查看全部无类似上架物品