说明
Wafer mounter配置
无配置OEM 型号描述
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.文件
无文件
TEIKOKU
ATM-800X
已验证
类别
Packaging
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115381
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEIKOKU
ATM-800X
类别
Packaging
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115381
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer mounter配置
无配置OEM 型号描述
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.文件
无文件