ASSCON Vapour-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes.Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The QUICKYSeries is designed to be used in the laboratory and for prototype production.

The goal is to develop and produce advanced and innovative vapor phase reflow soldering systems and to offer our customers a simple and high quality soldering process in the process. Vapor as an energy transfer medium is one of the most effective methods for heating assemblies. The efficiency is many times higher than, for example, heating by convection. 

QUICKY450

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