The Ultron Systems Model UH114/114-8 Wafer/Frame Film Applicators offer a high degree of control and versatility for your mounting requirements in affordable and easy-to-use benchtop packages. A wide range of standard features and available options assure bubble-free lamination to all sizes of wafers and types of film frames.

ULTRON SYSTEMS

UH114

FEATURES:
- Easily adjustable spring-loaded roller assembly
- Uniform film tension: Film tensioner bars (along both x/y-axes and front/rear for UH114;
- Uniform adhesion provides bubble-free lamination
- Circular cutter (wheel-type) for cutting film on film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Digital temperature controlled platen
- Adjustable workstage height from top of unit
- Operates with non-backed or backed (optional) film
- Accommodates film/protective layer wound on the outside or inside
- Adjustable alignment pins and vacuum cups
- Accepts all film frames (specify type and size)
- End cutter for film separation
- Accommodates wafer up to 6" capability (UH114);

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UH114

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