概述

Applied Producer HARP (High Aspect Ratio Process) is a thermal non-plasma-based CVD oxide product that addresses the stringent gap-fill requirements of applications such as STI and PMD for advanced logic FinFET and memory technology nodes. The Applied HARP process runs on the production-proven, high-throughput Producer platform. With its innovative Twin Chamber architecture, the Producer platform enables simultaneous processing of up to six wafers for superior productivity and significant reduction in cost of ownership with high system reliability. Platform extendibility enables customers to leverage the Producer toolset for multiple process nodes.