说明
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet included配置
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of silane oxides and nitrides -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 400 degreesOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件
类别
PECVD
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106186
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100 PECVD
类别
PECVD
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106186
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet included配置
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of silane oxides and nitrides -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 400 degreesOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件