说明
无说明配置
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
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OXFORD
PLASMALAB 100
已验证
类别
PECVD
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
113537
晶圆尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部OXFORD
PLASMALAB 100
类别
PECVD
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
113537
晶圆尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件