说明
无说明配置
1. Process module (ICP-RIE Etch, PECVD) . Process Chamber Inside 2. Loadlock (outside & Inside) 3. Gas Supply (ICP-RIE Etch, PECVD) -Gas Supply (for ICP-RIE Etch) ✓ HBr 50sccm ✓ BCl3 50sccm ✓ Cl2 50sccm ✓ SF6 100sccm ✓ Ar 100sccm ✓ O2 100sccm -Gas Supply (for PECVD) ✓ 5%SiH4/N2 1000sccm ✓ NH3 50sccm ✓ N2O 2000sccm ✓ N2 2000sccm ✓ O2 200sccm ✓ CF4 500sccm 4. Chiller 5. Power Transfer 6. PC * Pump : not includedOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
OXFORD
PLASMALAB 100
已验证
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103544
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103544
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available