说明
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though配置
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件
类别
PECVD
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
137095
晶圆尺寸：
未知
年份：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
OXFORD
PLASMALAB 100
类别
PECVD
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
137095
晶圆尺寸：
未知
年份：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though配置
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 型号描述
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文件
无文件