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PANASONIC NPM-W2
    说明
    无说明
    配置
    H16+H16
    OEM 型号描述
    NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.
    文件

    无文件

    类别
    Pick and Place

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    58969


    晶圆尺寸:

    未知


    年份:

    2017


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    PANASONIC

    NPM-W2

    verified-listing-icon
    已验证
    类别
    Pick and Place
    上次验证: 60 多天前
    listing-photo-a53ebcf4ef244a85b99a8d979635e480-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    58969


    晶圆尺寸:

    未知


    年份:

    2017


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    H16+H16
    OEM 型号描述
    NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.
    文件

    无文件